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学术报告信息
     日期:10-09
一、报告题目:“High-Speed Interconnects in Beyond-CMOS Era”
二、报告时间:2013年10月9日(周三)上午9:00
三、报告地点:斛兵楼阶梯报告厅 (计算机学院学术报告厅)
四、主办单位:电子科学与应用物理学院 微电子设计研究所
五、个人简介:
      Hui Wu received the B.Sc. degree in electrical engineering and M.Sc. degree in microelectronics from Tsinghua University in 1996 and 1998, and the Ph.D. degree in electrical engineering from California Institute of Technology in 2003, respectively.  He was a co-op researcher at IBM T. J. Watson Research Center in 2001, and a senior engineer at Axiom Microdevices in 2002-2003.
     In 2003, Dr. Wu joined the faculty of the University of Rochester, where he is an Associate Professor of Electrical and Computer Engineering and director of Laboratory for Advanced Integrated Circuits and Systems.  His current research interests are in inter-and intra-chip optical/electrical interconnects, wideband RF and high-speed integrated circuits, high performance clocking, wireless sensors, silicon photonics, electronic-photonic integrated circuits (EPIC), and nanoelectronics using emerging technologies.  Dr. Wu has authored and co-authored over sixty peer-reviewed papers in leading technical journals and conferences, and holds several U.S. patents.  He serves in the Technical Program Committee of IEEE Compound Semiconductor IC Symposium and review panels of JSSC, MTT, PTL and other journals.  Dr. Wu was the recipient of IBM Fellowship (2002) and winner of the Best Paper Award in SiRF conference (2008).
                                                                          电子科学与应用物理学院
                                                                            微电子设计研究所  
                                                                                 2013年10月8日
 
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